Development of high-resolution X-ray image intensifier for inspection of circuit boards

Because of the traditional inspection system not being able to detect the defects at solder joints and solder bridges in ball grid array (BGA ) as well as the emergence of miniaturized packaging, high-density assembly and various new packaging technologies, a high resolution inspection system is proposed to solve this problem. A new type of high-resolution X-ray image intensifier is introduced. As one of the key devices for circuit board testing and chip packaging detection, its resolution performance has become a bottleneck for the development of X-ray detection system. Its resolution reached 20lp/mm after the improvement of the fabrication process and the use of new window material for vacuum sealing.