Delta势垒结构对CMOS图像传感器表面暗电流抑制仿真研究

Simulating the Impact of Delta Barrier Structures on Surface Dark Current Suppression in CMOS Image Sensors

  • 摘要: 在CMOS图像传感器表面形成具有Delta结构(delta-doping)的势垒可以有效地解决传统CMOS图像传感器在辐照环境中的性能变化问题,势垒宽度、高度参数直接影响CMOS图像传感器表面暗电流,以及表面探测信号的效率。假设电子的总能量和横截隧穿方向满足薛定谔方程,计算了隧穿概率以及隧穿高度与宽度的关系,得出Delta掺杂势垒的最小宽度应该在1 nm以上,进而设计掺杂结构和掺杂浓度。讨论了Delta掺杂的CMOS具有高效、稳定和均匀的量子效率,能够提高低能电子探测,并在微光成像以及太空探测中做出贡献。

     

    Abstract: In CMOS image sensors, forming a barrier with a Delta structure (Delta-doping) on the surface can effectively resolve the issues of performance changes in traditional CMOS image sensors under irradiation environment. The width and height parameters of the barrier directly affect the dark current on the surface of the CMOS image sensor as well as the efficiency of surface signal detection. This paper assumes that the total energy of electrons and the cross-sectional direction of tunneling satisfy the Schrödinger equation, calculating the probability of tunneling and the relationship between the tunneling height and width, resulting in the conclusion that the minimum width of the Delta-doped barrier should be above 1 nm. From there, one can design the doping structure and doping concentration. The discussion covers that CMOS with Delta doping features high efficiency, stability, and uniform quantum efficiency, which enhances low-energy electron detection and contributes to low-light imaging and space exploration.

     

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